![]() An understanding of the thermal reflow profile is essential to control the soldering process and its process parameters, which will help in improving the performance of the solder, that is, it would be possible to influence the microstructure of the solder joint microstructure, increase the thickness of the intermetallic compound and improve the shear force it can sustain. In addition to the printing and placement of components in the reflow soldering process, the heat source is considered as one of the crucial steps in the processes. However, enhancing their reliability has remained an evolving challenge owing to the manufacturing processes. ![]() Electronic appliances, such as smartphones, electronic gadgets, and control systems available in the market are expected to meet challenging consumer demands, wherein the hardware plays a role enabling complicated functions as effective interfaces and durable components. Industrialists and researchers have diverted their focus towards miniaturization of electronic appliances over the last decade. The results are useful for studying further improvements to achieve temperature uniformity within the oven chamber. The rotational fan generates an unsteady flow that induces inhomogeneous temperature at different positions in the reflow oven cavity. An in-depth study using the simulation approach reveals that the temperature distribution of the desktop reflow oven is dependent on several factors, namely fan speed, FPCB position, and FPCB thickness. The FPCB surface also has a higher surface temperature than oven air during the operating reflow profile. It was found that the temperature distribution was inhomogeneous along with the phases. The simulation of the model has a great consensus between the experimental data. ![]() The experimental work acts as a benchmark and the reflow profile was set to follow the standards of JSTD-020E. Since the radiation effect is dominant in the reflow process, a discrete ordinate (DO) model was selected to simulate the effect. A computer-based model that imitates a real-time oven was developed with practical boundary conditions. This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering process. ![]()
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